Application Evaluation Printed Circuit Boards
NOTE:
Solder Paste: SMQ92J, Indium Corp
Solder Stencil Thickness: 5 mils screen
Solder Stencil QFN Ground Flag Area: 80% of sodlerable area
Solder Stencil QFN Lead Pad Area: 100% of solderable area
The ground flag requires good condition for optimum
intermodulation and C/I performance.
Figure 48. Recommended QFN Ground Flag Configuration
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MC13180 Product Preview
MOTOROLA