Freescale Semiconductor, Inc.
12.2
Thermal characteristics and power considerations
Table 12-2
The average chip junction temperature, TJ, in degrees Celcius can be obtained from the following
equation:
[1]
where:
TA = Ambient Temperature (C)
θJA = Package Thermal Resistance, Junction-to-ambient (C/W)
PD = PINT + PI/O (W)
PINT = Internal Chip Power = IDD • VDD (W)
PI/O = Power Dissipation on Input and Output pins (User determined)
An approximate relationship between PD and TJ (if PI/O is neglected) is:
[2]
Solving equations [1] and [2] for K gives:
[3]
where K is a constant for a particular part. K can be determined by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained for any value of TA
by solving the above equations. The package thermal characteristics are shown in Table 12-2.
12
MOTOROLA
12-2
ELECTRICAL SPECIFICATIONS
MC68HC05L28
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