APA4863KI-TR 查看數據表（PDF） - Anpec Electronics
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APA4863KI-TR Datasheet PDF : 17 Pages
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APA4863
Packaging Information
TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153)
e
N
2x E/2
E1 E
1 23
e/2
D
b
D1
EXPOSED THERMAL
PAD ZONE
A2
A
A1
E2
0.25
BOTTOM VIEW
(THERMALLY ENHANCED VARIATIONDS ONLY)
( 3)
( 2)
S
GAUGE
PLANE
R1
R
L
1
(L1)
Dim
Millimeters
Min.
Max.
A
1.2
A1
0.00
0.15
A2
0.80
1.05
D
6.4 (N=20PIN)
6.6 (N=20PIN)
7.7 (N=24PIN)
7.9 (N=24PIN)
D1
2.20 (N=20PIN)
2.70 (N=24PIN) Thermally Enhanced
e
0.65 BSC
E
6.40 BSC
E1
4.30
4.50
E2
1.50
L
0.45
0.75
L1
1.0 REF
R
0.09
R1
0.09
S
0.2
φ1
0°
8°
φ2
12° REF
φ3
12° REF
Copyright ANPEC Electronics Corp.
13
Rev. A.3 - Apr., 2001
Inches
Min.
Max.
0.047
0.000
0.006
0.031
0.041
0.252 (N=20PIN) 0.260 (N=20PIN)
0.303 (N=24PIN) 0.311 (N=24PIN)
0.087 (N=20PIN)
0.106 (N=24PIN) Thermally Enhanced
0.026 BSC
0.252 BSC
0.169
0.177
0.059
0.018
0.030
0.039REF
0.004
0.004
0.008
0°
8°
12° REF
12° REF
www.anpec.com.tw
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