APPENDIX A: REVISION HISTORY
Revision B (September 2005)
The following is the list of modifications:
1. Changed pin 6 in Package Types diagram on
front page.
2. Removed device qualification note in Package
Marking section.
3. Removed device qualification note in Package
Outline drawing.
4. Removed device qualification note in Package
Identification System section
5. Replaced MSOP and QFN package diagrams.
Revision A (December 2004)
• Original Release of this Document.
MCP1612
© 2005 Microchip Technology Inc.
DS21921B-page 17