MCP1700T-5002E 查看數據表（PDF） - Microchip Technology

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MCP1700T-5002E

Low Quiescent Current LDO

Microchip Technology 

MCP1700

3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

D1

E

H

L

1

2

N

b

b1

b1

e

e1

E1

A

C

Units

Dimension Limits

MILLIMETERS

MIN

MAX

Number of Leads

Pitch

Outside Lead Pitch

Overall Height

N

3

e

1.50 BSC

e1

3.00 BSC

A

1.40

1.60

Overall Width

Molded Package Width at Base

Molded Package Width at Top

H

3.94

4.25

E

2.29

2.60

E1

2.13

2.29

Overall Length

Tab Length

Foot Length

D

4.39

4.60

D1

1.40

1.83

L

0.79

1.20

Lead Thickness

c

0.35

0.44

Lead 2 Width

b

0.41

0.56

Notes:

Leads 1 & 3 Width

b1

0.36

0.48

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-029B

© 2007 Microchip Technology Inc.

DS21826B-page 17

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