MCR8DSM 查看數據表（PDF） - ON Semiconductor
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MCR8DSM Datasheet PDF : 6 Pages
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MCR8DSM, MCR8DSN
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance − Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
RqJC
RqJA
RqJA
TL
Max
Unit
2.2
°C/W
88
80
260
°C
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristics
OFF CHARACTERISTICS
Symbol
Min Typ Max Unit
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM; RGK = 1.0 kW) (Note 3)
ON CHARACTERISTICS
TJ = 25°C
TJ = 110°C
IDRM
IRRM
mA
−
−
10
−
−
500
Peak Reverse Gate Blocking Voltage (IGR = 10 mA)
Peak Reverse Gate Blocking Current (VGR = 10 V)
Peak Forward On−State Voltage (Note 4) (ITM = 16 A)
Gate Trigger Current (Continuous dc) (Note 5)
(VD = 12 V, RL = 100 W)
TJ = 25°C
TJ = −40°C
Gate Trigger Voltage (Continuous dc) (Note 5)
(VD = 12 V, RL = 100 W)
TJ = 25°C
TJ = −40°C
TJ = 110°C
Holding Current
(VD = 12 V, Initiating Current = 200 mA, Gate Open)
TJ = 25°C
TJ = −40°C
Latching Current
(VD = 12 V, IG = 2.0 mA)
TJ = 25°C
TJ = −40°C
Total Turn−On Time
(Source Voltage = 12 V, RS = 6.0 kW, IT = 16 A(pk), RGK = 1.0 kW)
(VD = Rated VDRM, Rise Time = 20kns, Pulse Width = 10 ms)
DYNAMIC CHARACTERISTICS
VGRM
IRGM
VTM
IGT
VGT
IH
IL
tgt
10 12.5 18
V
−
−
1.2
mA
−
1.4 1.8
V
mA
5.0 12 200
−
−
300
V
0.45 0.65 1.0
−
−
1.5
0.2
−
−
mA
0.5 1.0 6.0
−
−
10
mA
0.5 1.0 6.0
−
−
10
ms
−
2.0 5.0
Critical Rate of Rise of Off−State Voltage
dv/dt
V/ms
(VD = 0.67 X Rated VDRM, Exponential Waveform,
RGK = 1.0 kW, TJ = 110°C)
2.0 10
−
2. Surface mounted on minimum recommended pad size.
3. Ratings apply for negative gate voltage or RGK = 1.0 kW. Devices shall not have a positive gate voltage concurrently with a negative voltage
on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the voltage
applied exceeds the rated blocking voltage.
4. Pulse Test; Pulse Width ≤ 2.0 msec, Duty Cycle ≤ 2%.
5. RGK current not included in measurements.
ORDERING INFORMATION
Device
Package
Shipping†
MCR8DSMT4
DPAK
MCR8DSMT4G
MCR8DSNT4
DPAK
(Pb−Free)
DPAK
2500 / Tape & Reel
MCR8DSNT4G
DPAK
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
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