MPC7445 查看數據表（PDF） - Freescale Semiconductor

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MPC7445

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7455.

Table 5. Package Thermal Characteristics 6

Characteristic

Symbol

Value

MPC7445 MPC7455

Unit Notes

Junction-to-ambient thermal resistance, natural

convection

RθJA

22

20

°C/W 1, 2

Junction-to-ambient thermal resistance, natural

convection, four-layer (2s2p) board

RθJMA

14

14

°C/W 1, 3

Junction-to-ambient thermal resistance, 200 ft/min

RθJMA

16

airflow, single-layer (1s) board

15

°C/W 1, 3

Junction-to-ambient thermal resistance, 200 ft/min

RθJMA

11

airflow, four-layer (2s2p) board

11

°C/W 1, 3

Junction-to-board thermal resistance

RθJB

6

6

°C/W

4

Junction-to-case thermal resistance

RθJC

<0.1

<0.1

°C/W

5

Notes:

1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less

than 0.1°C/W.

6. Refer to Section 9.8, “Thermal Management Information,” for more details about thermal management.

Table 6 provides the DC electrical characteristics for the MPC7455.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Input high voltage

(all inputs except SYSCLK)

Input low voltage

(all inputs except SYSCLK)

SYSCLK input high voltage

SYSCLK input low voltage

Nominal

Bus Symbol

Min

Voltage 1

Max

Unit Notes

1.5

VIH

GVDD × 0.65

GVDD + 0.3

V

6

1.8

VIH OVDD/GVDD × 0.65 OVDD/GVDD + 0.3 V

2.5

VIH

1.7

OVDD/GVDD + 0.3 V

1.5

VIL

–0.3

GVDD × 0.35

V

6

1.8

VIL

–0.3

OVDD/GVDD × 0.35 V

2.5

VIL

–0.3

0.7

V

—

CVIH

1.4

OVDD + 0.3

V

—

CVIL

–0.3

0.4

V

MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1

Freescale Semiconductor

13

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