MPXV7007 查看數據表（PDF） - Freescale Semiconductor
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产品描述 (功能)
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MPXV7007
Freescale Semiconductor
MPXV7007 Datasheet PDF : 10 Pages
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PACKAGE DIMENSIONS
Pressure
2 PLACES 4 TIPS
0.008 (0.20) C A B
A
E
e
5
4
e/2
D
GAGE
PLANE
.014 (0.35)
θ
L
A1
DETAIL G
8
F
1
8X b
0.004 (0.1) M C A B
B
E1
∅T
N
K
A
M
8X 0.004 (0.1)
P
DETAIL G
C
SEATING
PLANE
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.300 0.330 7.11 7.62
A1 0.002 0.010 0.05 0.25
b 0.038 0.042 0.96 1.07
D 0.465 0.485 11.81 12.32
E 0.717 BSC
18.21 BSC
E1 0.465 0.485 11.81 12.32
e 0.100 BSC
2.54 BSC
F 0.245 0.255 6.22 6.47
K 0.120 0.130 3.05 3.30
L 0.061 0.071 1.55 1.80
M 0.270 0.290 6.86 7.36
N 0.080 0.090 2.03 2.28
P 0.009 0.011 0.23 0.28
T 0.115 0.125 2.92 3.17
θ 0˚
7˚
0˚
7˚
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPXV7007
9
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