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NCP1077 查看數據表(PDF) - ON Semiconductor

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NCP1077 Datasheet PDF : 30 Pages
First Prev 21 22 23 24 25 26 27 28 29 30
NCP1070, NCP1071, NCP1072, NCP1075, NCP1076, NCP1077
PACKAGE DIMENSIONS
PDIP−7 (PDIP−8 LESS PIN 6)
CASE 626A
ISSUE C
NOTE 8
A1
D1
D
A
8
5
E1
1
4
E
H
b2 B
TOP VIEW
A2
e/2
A NOTE 3
L
c
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
e
SIDE VIEW
SEATING
PLANE
C
M
8X b
0.010 M C A M B M
eB
END VIEW
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
DIM MIN MAX
A −−−− 0.210
A1 0.015 −−−−
A2 0.115 0.195
b 0.014 0.022
b2 0.060 TYP
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
E 0.300 0.325
E1 0.240 0.280
e 0.100 BSC
eB −−−− 0.430
L 0.115 0.150
M −−−− 10 °
MILLIMETERS
MIN MAX
−−− 5.33
0.38 −−−
2.92 4.95
0.35 0.56
1.52 TYP
0.20 0.36
9.02 10.16
0.13 −−−
7.62 8.26
6.10 7.11
2.54 BSC
−−− 10.92
2.92 3.81
−−−
10 °
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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For additional information, please contact your local
Sales Representative
NCP1070/D

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