NCP1288
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Pin (pin 6) (Note 1)
Voltage range
Current range
VCCMAX
–0.3 to 28
V
ICCMAX
$30
mA
High Voltage Pin (pin 8) (Note 1)
Voltage range
Current range
Driver Pin (pin 5) (Note 1)
Voltage range
Current range
All other pins (Note 1)
Voltage range
Current range
Thermal Resistance
Junction−to−Air, low conductivity PCB (Note 2)
Junction−to−Air, medium conductivity PCB (Note 3)
Junction−to−Air, high conductivity PCB (Note 4)
VHVMAX
IHVMAX
–0.3 to 500
$20
VDRVMAX
IDRVMAX
–0.3 to 20
$1500
VMAX
IMAX
RqJA
–0.3 to 10
$10
162
147
125
V
mA
V
mA
V
mA
°C/W
Temperature Range
Operating Junction Temperature
Storage Temperature Range
°C
TJMAX
−40 to +150
TSTRGMAX −60 to +150
ESD Capability
Human Body Model (HBM) per JEDEC standard JESD22, Method A114E (All pins except HV)
Machine Model (MM) per JEDEC standard JESD22, Method A115A
V
2000
200
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78
2. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow.
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