NCP3488 查看數據表（PDF） - ON Semiconductor
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NCP3488 Datasheet PDF : 7 Pages
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NCP3488
MAXIMUM RATINGS
Rating
Value
Unit
Operating Ambient Temperature, TA
Operating Junction Temperature, TJ (Note 1)
Package Thermal Resistance: SO−8
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA (2−Layer Board)
Storage Temperature Range, TS
Lead Temperature Soldering (10 sec): Reflow (SMD styles only)
0 to 85
0 to 150
Pb−Free (Note 3)
45
123
−65 to 150
260 peak
°C
°C
°C/W
°C/W
°C
°C
JEDEC Moisture Sensitivity Level
(260 peak profile)
1
−
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150°C min.
2. 2 layer board, 1 in2 Cu, 1 oz thickness.
3. 60−180 seconds minimum above 237°C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
MAXIMUM RATINGS
Pin Symbol
VCC
BST
Pin Name
Main Supply Voltage Input
Bootstrap Supply Voltage Input
SW
DRVH
Switching Node
(Bootstrap Supply Return)
High−Side Driver Output
DRVL
Low−Side Driver Output
IN
DRVH and DRVL Control Input
OD
Output Disable
PGND
Ground
NOTE: All voltages are with respect to PGND except where noted.
VMAX
15 V
30 V wrt/PGND
35 V v 50 ns wrt/PGND
15 V wrt/SW
30 V
BST + 0.3 V
35 V v 50 ns wrt/PGND
15 V wrt/SW
VCC + 0.3 V
VCC + 0.3 V
VCC + 0.3 V
0V
VMIN
−0.3 V
−0.3 V wrt/SW
−1.0 V DC
−10 V< 200 ns
−0.3 V wrt/SW
−0.3 V DC
−2.0 V < 200 ns
−0.3 V
−0.3 V
0V
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