NCP4620 查看數據表（PDF） - ON Semiconductor

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NCP4620

150 mA, 10 V, Low Dropout Regulator

ON Semiconductor 

NCP4620

APPLICATION INFORMATION

A typical application circuit for NCP4620 series is shown

in Figure 38.

VIN

C1

1m

NCP4620x

VIN

VOUT

CE

GND

VOUT

C2

1m

Enable Operation

The enable pin CE may be used for turning the regulator

on and off. The IC is switched on when a high level voltage

is applied to the CE pin. The enable pin has an internal pull

down current source. If the enable function is not needed

connect CE pin to VIN.

Output Discharger

The D version includes a transistor between VOUT and

GND that is used for faster discharging of the output

capacitor. This function is activated when the IC goes into

disable mode.

Figure 38. Typical Application Schematic

Input Decoupling Capacitor (C1)

A 1 mF ceramic input decoupling capacitor should be

connected as close as possible to the input and ground pin of

the NCP4620. Higher values and lower ESR improves line

transient response.

Output Decoupling Capacitor (C2)

A 1 mF ceramic output decoupling capacitor is enough to

achieve stable operation of the IC. If a tantalum capacitor is

used, and its ESR is high, loop oscillation may result. The

capacitors should be connected as close as possible to the

output and ground pins. Larger values and lower ESR

improves dynamic parameters.

Thermal

As a power across the IC increase, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and also the ambient

temperature affect the rate of temperature increase for the

part. When the device has good thermal conductivity

through the PCB the junction temperature will be relatively

low in high power dissipation applications.

PCB layout

Make the VIN and GND line as large as practical. If their

impedance is high, noise pickup or unstable operation may

result. Connect capacitors C1 and C2 as close as possible to

the IC, and make wiring as short as possible.

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