NCV4275ADT33RKG 查看數據表（PDF） - ON Semiconductor
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NCV4275ADT33RKG Datasheet PDF : 19 Pages
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NCV4275A
PACKAGE DIMENSIONS
DPAK 5, CENTER LEAD CROP
DT SUFFIX
CASE 175AA−01
ISSUE A
B
V
R
−T−
SEATING
PLANE
C
E
A
S
12 3 4 5
U
K
F
J
L
H
D 5 PL
G
0.13 (0.005) M T
R1
Z
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.020 0.028
E 0.018 0.023
F 0.024 0.032
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.045 BSC
R 0.170 0.190
R1 0.185 0.210
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 0.170
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.51 0.71
0.46 0.58
0.61 0.81
4.56 BSC
0.87 1.01
0.46 0.58
2.60 2.89
1.14 BSC
4.32 4.83
4.70 5.33
0.63 1.01
0.51 −−−
0.89 1.27
3.93 4.32
SOLDERING FOOTPRINT*
6.4
0.252
2.2
0.086
5.8
0.228
0.34 5.36
0.013 0.217
10.6
0.417
0.8
0.031
ǒ Ǔ SCALE 4:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
18
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