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NX2415 查看數據表(PDF) - Microsemi Corporation

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NX2415 Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
as to the load as possible and plane connection is re-
quired.
4. Drain of the low-side MOSFET and source of
the high-side MOSFET need to be connected thru a plane
ans as close as possible. A snubber nedds to be placed
as close to this junction as possible.
5. Source of the lower MOSFET needs to be con-
nected to the GND plane with multiple vias. One is not
enough. This is very important. The same applies to the
output capacitors and input capacitors.
6. Hdrv and Ldrv pins should be as close to
MOSFET gate as possible. The gate traces should be
wide and short. A place for gate drv resistors is needed
to fine tune noise if needed.
7. Vcc capacitor, BST capacitor or any other by-
passing capacitor needs to be placed first around the IC
and as close as possible. The capacitor on comp to
GND or comp back to FB needs to be place as close to
the pin as well as resistor divider.
8. The output sense line which is sensing output
back to the resistor divider should not go through high
frequency signals.
9. All GNDs need to go directly thru via to GND
plane.
10. The feedback part of the system should be
kept away from the inductor and other noise sources,
and be placed close to the IC.
11. In multilayer PCB, separate power ground and
analog ground. These two grounds must be connected
together on the PC board layout at a single point. The
goal is to localize the high current path to a separate
loop that does not interfere with the more sensitive ana-
log control function.
12. Inductor current sense line should be con-
nected directly to the inductor solder pad.
Rev.4.8
05/06/08
NX2415
19

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