HFA1150IH96 查看數據表（PDF） - Intersil
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HFA1150IH96 Datasheet PDF : 13 Pages
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Die Characteristics
DIE DIMENSIONS:
53 mils x 25mils
1350µm x 630µm
METALLIZATION:
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
HFA1150
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
40
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
HFA1150
V+
OUT
V-
-IN
+IN
11
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