NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I2C-bus with interrupt
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm SOT556-1
D
E
A
X
c
y
HE
vM A
Z
24
13
1
e
A2
A1
12
bp
wM
A
(A 3)
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(1)
e
HE
mm
1.73
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635
6.2
5.8
L
Lp
v
w
y
Z(1)
θ
1
0.89
0.41
0.25
0.18
0.1
1.05
0.66
8o
0o
inches
0.068
0.0098
0.0040
0.061
0.055
0.01
0.012 0.0098 0.344
0.008 0.0075 0.337
0.157
0.150
0.025
0.244
0.228
0.041
0.035
0.016
0.01
0.007
0.004
0.040
0.026
8o
0o
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT556-1
REFERENCES
JEDEC
JEITA
MO-137
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 24. Package outline SOT556-1 (SSOP24)
PCA8575_1
Objective data sheet
Rev. 01 — 30 November 2006
© NXP B.V. 2006. All rights reserved.
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