PCA9554AN 查看數據表（PDF） - NXP Semiconductors.

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PCA9554AN

8-bit I²C-bus and SMBus I/O port with interrupt

NXP Semiconductors. 

NXP Semiconductors

PCA9554/PCA9554A

8-bit I2C-bus and SMBus I/O port with interrupt

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 11 and 12

Table 11. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

220

Table 12. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

350 to 2000

< 1.6

260

260

1.6 to 2.5

260

250

> 2.5

250

245

> 2000

260

245

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 25.

temperature

maximum peak temperature

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 25. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

PCA9554_9554A_7

Product data sheet

Rev. 07 — 13 November 2006

© NXP B.V. 2006. All rights reserved.

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