NXP Semiconductors
14. Soldering: PCB footprints
Footprint information for reflow soldering of SO16 package
PCA9554; PCA9554A
8-bit I2C-bus and SMBus I/O port with interrupt
SOT162-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
By Ay
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
1.270 1.320 11.200 6.400 2.400 0.700 0.800 10.040 8.600 11.900 11.450
Fig 24. PCB footprint for SOT162-1 (SO16); reflow soldering
PCA9554_9554A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 19 March 2013
sot162-1_fr
© NXP B.V. 2013. All rights reserved.
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