NXP Semiconductors
15. Package outline
PCA9555A
Low-voltage 16-bit I2C-bus I/O port with interrupt and weak pull-up
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
y
Z
24
pin 1 index
1
e
E
A
X
c
HE
vM A
13
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT355-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 30. Package outline SOT355-1 (TSSOP24)
PCA9555A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 September 2012
© NXP B.V. 2012. All rights reserved.
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