PCF2103 查看數據表（PDF） - Philips Electronics
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PCF2103 Datasheet PDF : 56 Pages
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Philips Semiconductors
LCD controllers/drivers
SYMBOL
PAD
C4
76
C3
77
C3 (dummy) 78
C2 (dummy) 79
C2
80
C1
81
R8
82
R7
83
R6
84
R5
85
R4
86
R3
87
R2
88
R1
89
R17
90
SCL
91
SDA
92
E
93
RS
94
RW
95
DB7
96
DB6
97
DB5
98
DB4
99
DB3
100
DB2
101
DB1
102
DB0
103
DB0 (dummy) 104
Rec. Pat. C1
Rec. Pat. C2
Rec. Pat. F
X
−986
−1 076
−1 166
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
−1 344
1 335
−1 335
−1 340
Y
1 414
1 414
1 414
1 303
1 213
1 123
1 033
943
853
763
673
583
493
403
313
131
−9
−195
−289
−382
−476
−572
−668
−765
−861
−957
−1 054
−1 150
−1 240
−1 405
1 405
−1 397
Product specification
PCF2103 family
Table 19 Bump specifications
PARAMETER
SPECIFICATION
Bump variant
N
Type
galvanic; pure
aurum
Bump width
60 ±6
Bump length
Bump height
90 ±6
17.5 ±5
Height difference in one <2
die
Convex deformation
<5
Pad size; aluminium
80 × 100
Passivation opening CBB 46 × 76
Wafer thickness
380 ±25
Minimum pitch
90
UNIT
−
−
µm
µm
µm
µm
µm
µm
µm
µm
µm
1998 May 11
53
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