PCF2113WU 查看數據表（PDF） - NXP Semiconductors.
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PCF2113WU Datasheet PDF : 65 Pages
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NXP Semiconductors
PCF2113x
LCD controllers/drivers
Table 30. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
< 1.6
260
260
1.6 to 2.5
260
250
> 2.5
250
245
> 2000
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 42.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 42. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCF2113_FAM_4
Product data sheet
Rev. 04 — 4 March 2008
© NXP B.V. 2008. All rights reserved.
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