RA8816 查看數據表（PDF） - RAIO

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RA8816

144x65 Character/Graphic LCD Driver

RAIO 

Preliminary Version 1.6

RA8816

144x65 Character/Graphic LCD Driver

Chip PAD

ITO Layout

FPC PAD

Figure A-7：ITO Layout Example - VLCD

The RA8816 power signals (such as VDD, GND, VLCD, V[4..0], C1P, C1M, C2P, C2M) have to keep

the smaller ITO resistance(less than 15 ohm is better) for panel layout. So the wires of layout need to

keep as thick as possible to reduce the ITO resistance. The Figure A-7 is an example for VLCD layout of

panel. Because the RA8816 provide six pads for VLCD, therefore the layout engineer has to connect all

of these pads to FPC. In this case, the VLCD is three times of VDD, so the C3P have to connect to

VLCD and do not forget keep the wire thicker.

Chip Pad

ITO Layout

FPC Pad

Figure A-8：ITO Layout Example

The Figure A-8 is a layout example of RA8816 to FPC on COG module. The VDD and GND of RA8816

should as close as possible to FPC. The RA8816 provide six GND pad, user have to connect these six

pads to FPC with a thick wire. For the design of FPC, the related power signals(VDD, GND, VLCD) of

layout need to keep as thick as possible to reduce the wire resistance. And the VDD, GND pad of FPC

keep double width than other signals. For example, if panel resolution is 128x64 then use 4X VDD for

booster and LCD voltage less than 9V is better.

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