RF3807 查看數據表（PDF） - RF Micro Devices

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RF3807

GaAs HBT PRE-DRIVER AMPLIFIER

RF Micro Devices 

RF3807

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch

to 8μinch gold over 180μinch nickel.

PCB Land Pattern Recommendation

PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown

has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate

lead and package tolerances. Since surface mount processes vary from company to company, careful process development is

recommended.

PCB Metal Land Pattern

A = 1.14 x 0.71

B = 1.02 x 0.71 Typ.

C = 3.96 x 4.44

Dimensions in

mm.

5.93

Pin 1

A

B

1.27 Typ.

B

B 1.90

C

3.81 Typ.

B

B

B

B

3.00

5.99 Typ.

PCB Solder Mask Pattern

Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB

metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The

center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be

provided in the master data or requested from the PCB fabrication supplier.

A = 1.30 x 0.86

B = 1.17 x 0.86 Typ.

C = 4.11 x 4.60

Dimensions in

mm.

5.93

Pin 1

A

B

1.27 Typ.

B

B

1.90

C

3.81 Typ.

B

B

B

B

3.00

5.99 Typ.

Rev A5 DS080220

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

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