RP100N261B 查看數據表（PDF） - RICOH Co.,Ltd.
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RP100N261B Datasheet PDF : 28 Pages
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PACKAGE INFORMATION
PE-SOT-23-5-0610
POWER DISSIPATION (SOT-23-5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
Standard Land Pattern
420mW
θja=(125−25°C)/0.42W=263°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
250mW
400°C/W
600
40
500
On Board
420
400
300 250
Free Air
200
100
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Power Dissipation
RECOMMENDED LAND PATTERN
0.7 MAX.
Measurement Board Pattern
IC Mount Area Unit : mm
1.0
2.4
0.95 0.95
1.9
(Unit: mm)
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