RT8269GSP 查看數據表（PDF） - Richtek Technology
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RT8269GSP Datasheet PDF : 12 Pages
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RT8269
GND
VIN SW
CB
Input capacitor must be placed
as close to the IC as possible.
COUT
The output capacitor must be
placed near the IC.
VOUT
CIN
D1
L1
BOOT
VIN
SW
GND
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
CS
8
2 GND 7
3
6
4
5
The parallel distance between
COMP and FB traces must be
SS
as short as possible.
EN
CC
COMP
FB CP
RC
GND
VOUT
The resistor divider must be connected
as close to the device as possible.
Figure 4. PCB Layout Guide
Table 2. Suggested Inductors for Typical Application Circuit
Component Supplier Series Inductance (µH) DCR (mΩ)
TDK
VLF10045
10
25
TAIYO YUDEN
NR8040
10
34
Current Rating (A) Dimensions (mm)
4.3
10 x 9.7 x 4.5
3.4
8x8 x4
Table 3. Suggested Capacitors for CIN and COUT
Component Supplier
Part No.
MURATA
GRM31CR61E106K
TDK
C3225X5R1E106K
TAIYO YUDEN
TMK316BJ106ML
MURATA
GRM31CR60J476M
TDK
C3225X5R0J476M
TAIYO YUDEN
EMK325BJ476MM
MURATA
GRM32ER71C226M
TDK
C3225X5R1C226M
Capacitance (µF)
10
10
10
47
47
47
22
22
Case Size
1206
1206
1206
1206
1210
1210
1210
1210
Table 4. Suggested Diode
Component Supplier Series
DIODES
B330A
DIODES
B340
PANJIT
SK33
PANJIT
SK34
VRRM (V)
30
40
30
40
IOUT (A)
3
3
3
3
Package
DO-214AC
DO-214AB
DO-214AB
DO-214AB
DS8269-02 March 2011
www.richtek.com
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