TDA8310 查看數據表（PDF） - Philips Electronics

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TDA8310

PAL/NTSC colour processor for PIP applications

Philips Electronics 

Philips Semiconductors

PAL/NTSC colour processor for

PIP applications

PACKAGE OUTLINE

Preliminary specification

TDA8310

handbook, full pagewidth

3.2

2.8

1.73

max

52

1

47.92

47.02

1.778

(25x)

4.57 5.08

max max

0.51

min

0.18 M

0.53

max

1.3 max

15.80

15.24

0.32 max

15.24

17.15

15.90

MSA267

27

14.1

13.7

26

Dimensions in mm.

Fig.4 Plastic shrink dual in-line package; 52 leads; 600 mil (SDIP52, SOT247-1).

SOLDERING

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron below the seating plane

(or not more than 2 mm above it). If its temperature is

below 300 °C, it must not be in contact for more than 10 s;

if between 300 and 400 °C, for not more than 5 s.

February 1995

21

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