XC2365 查看數據表（PDF） - Infineon Technologies

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XC2365

16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

Infineon Technologies 

XC2365

XC2000 Family Derivatives

Preliminary

Package and Reliability

5

Package and Reliability

In addition to the electrical parameters, the following information ensures proper

integration of the XC236x into the target system.

5.1

Packaging

These parameters describe the housing rather than the silicon.

Table 24 Package Parameters (PG-LQFP-100)

Parameter

Symbol

Limit Values Unit Notes

Min.

Max.

Exposed Pad Dimension Ex × Ey –

6.2 × 6.2 mm –

Power Dissipation

Thermal resistance

Junction-Ambient

PDISS

–

RΘJA

–

1.0

W

–

49

K/W No thermal via1)

37

K/W 4-layer, no pad2)

22

K/W 4-layer, pad3)

1) Device mounted on a 2-layer or 4-layer board without thermal vias.

2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.

3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.

Data Sheet

94

V0.1, 2007-06

Draft Version

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