Version 1.2 (not for new design in automotive applications)
SFH 3010
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
2
3
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
TL
Time above liquidus temperature
tL
100
120
2
3
217
80
100
Peak temperature
TP
245
260
Time within 5 °C of the specified peak tP
10
20
30
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
Time
25 °C to TP
3
6
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
OHA04612
Unit
Einheit
K/s
s
K/s
°C
s
°C
s
K/s
s
1.5 (0.059)
4 (0.157)
2 (0.079)
Dimensions in mm (inch).
0.9 (0.035)
C
A
0.8 (0.031)
OHAY1491
2015-12-08
8