87C196(1998) 查看數據表（PDF） - Intel

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87C196
(Rev.:1998)

ADVANCED 16-BIT CHMOS MICROCONTROLLER WITH INTEGRATED CAN 2.0

Intel 

87C196CA/87C196CB - Express

3.0

PROCESS INFORMATION

These devices are manufactured on P629.5, a CHMOS III-E process. Additional process and

reliability information is available in Intel’s Components Quality and Reliability Handbook, Order

Number 210997.

All thermal impedance data is approximate for static air conditions at 1 W of power dissipation.

Values change depending on operation conditions and applications. See the Intel Packaging

Handbook (order number 240800) for a description of Intel’s thermal impedance test methodology.

Figure 2. The 87C196CA/87C196CB - Express Family Nomenclature

T N 8 7 C 1 9 6 C A/B

Product Designation

Product Family

CHMOS Technology

Program Memory Options:

7 = EPROM, OTP

0 = CPU

Package Type Options:

N = PLCC (plastic leaded chip carrier)

Temperature and Burn-in Options:

T = -40˚C to + 85˚C

ambient with

Intel Standard Burn-in

A4582-01

Table 1. Thermal Characteristics

Device and Package

ΘJA

ΘJC

TN87C196CB

(84-Lead PLCC Package)

35°C/W

11°C/W

TN87C196CA

(68-Lead PLCC Package)

36.5°C/W

10°C/W

NOTES:

1. ΘJA = Thermal resistance between junction and the surrounding environment (ambient) measurements are

taken 1 ft. away from case in air flow environment.

ΘJV = Thermal resistance between junction and package face (case).

2. All values of ΘJA and ΘJC may fluctuate depending on the environment (with or without airflow, and how

much airflow) and device power dissipation at temperature of operation. Typical variations are ± 2°C/W.

3. Values listed are at a maximum power dissipation of 1 W.

ADVANCE INFORMATION Datasheet

3

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