TC1073-3.3VCH713 查看數據表（PDF） - Microchip Technology

零件编号

产品描述 (功能)

生产厂家

TC1073-3.3VCH713

50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and VREF Bypass

Microchip Technology 

5.0 THERMAL CONSIDERATIONS

5.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the

regulator off when die temperature exceeds 160°C.

The regulator remains off until the die temperature

drops to approximately 150°C.

5.2 Power Dissipation

The amount of power the regulator dissipates is

primarily a function of input and output voltage, and

output current. The following equation is used to

calculate worst-case actual power dissipation:

EQUATION 5-1:

PD ≈ (VINMAX – VOUTMIN)ILOADMAX

Where:

PD = Worst-case actual power dissipation

VINMAX = Maximum voltage on VIN

VOUTMIN = Minimum regulator output voltage

ILOADMAX = Maximum output (load) current

The maximum allowable power dissipation

(Equation 5-2) is a function of the maximum ambient

temperature (TAMAX), the maximum allowable die tem-

perature (TJMAX) and the thermal resistance from junc-

tion-to-air (θJA). The 6-Pin SOT-23 package has a θJA

of approximately 220°C/Watt.

EQUATION 5-2:

PDMAX = (TJMAX – TAMAX)

θJA

where all terms are previously defined.

TC1072/TC1073

Equation 5-1 can be used in conjunction with

Equation 5-2 to ensure regulator thermal operation is

within limits. For example:

Given:

VINMAX

= 3.0V ±5%

VOUTMIN

= 2.7V – 2.5%

ILOADMAX

= 40 mA

TJMAX

= 125°C

TAMAX

= 55°C

Find: 1. Actual power dissipation

2. Maximum allowable dissipation

Actual power dissipation:

PD ≈ (VINMAX – VOUTMIN)ILOADMAX

= [(3.0 x 1.05) – (2.7 x 0.975)] x 40 x 10–3

= 20.7 mW

Maximum allowable power dissipation:

PDMAX = (TJMAX – TAMAX)

θJA

= (125 – 55)

220

= 318 mW

In this example, the TC1072 dissipates a maximum of

20.7 mW; below the allowable limit of 318 mW. In a

similar manner, Equation 5-1 and Equation 5-2 can be

used to calculate maximum current and/or input

voltage limits.

5.3 Layout Considerations

The primary path of heat conduction out of the package

is via the package leads. Therefore, layouts having a

ground plane, wide traces at the pads, and wide power

supply bus lines combine to lower θJA and therefore

increase the maximum allowable power dissipation

limit.

© 2007 Microchip Technology Inc.

DS21354D-page 13

Share Link: