TC1073-2.8VCH713 查看數據表（PDF） - Microchip Technology

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TC1073-2.8VCH713

50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and VREF Bypass

Microchip Technology 

TC1072/TC1073

6-Lead Plastic Small Outline Transistor (CH) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

N

4

PIN 1 ID BY

LASER MARK

1

2

3

e

e1

D

E

E1

A

A2 c

φ

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

6

Pitch

e

0.95 BSC

Outside Lead Pitch

e1

1.90 BSC

Overall Height

A

0.90

–

1.45

Molded Package Thickness

A2

0.89

–

1.30

Standoff

A1

0.00

–

0.15

Overall Width

E

2.20

–

3.20

Molded Package Width

E1

1.30

–

1.80

Overall Length

D

2.70

–

3.10

Foot Length

L

0.10

–

0.60

Footprint

L1

0.35

–

0.80

Foot Angle

φ

0°

–

30°

Lead Thickness

c

0.08

–

0.26

Notes:

Lead Width

b

0.20

–

0.51

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-028B

© 2007 Microchip Technology Inc.

DS21354D-page 15

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