TC72 查看數據表（PDF） - Microchip Technology
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TC72 Datasheet PDF : 24 Pages
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8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
TC72
E
D
p
b
n
L
D2
TOP VIEW
EXPOSED
METAL
PAD
21
E2
BOTTOM VIEW
PIN 1
ID INDEX
AREA
(NOTE 2)
A
A3
A1
EXPOSED
TIE BAR
(NOTE 1)
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Standoff
A1
Lead Thickness
A3
Overall Length
E
Exposed Pad Length (Note 4)
E2
Overall Width
D
Exposed Pad Width (Note 4)
D2
Lead Width
b
Lead Length
L
MIN
.031
.000
.055
.047
.007
.012
INCHES
NOM
8
.026 BSC
.035
.001
.008 REF.
.118 BSC
.118 BSC
.010
.019
MAX
.039
.002
.096
.069
.015
.022
MILLIMETERS*
MIN
NOM
8
0.65 BSC
0.80
0.90
0.00
0.02
0.20 REF.
3.00 BSC
1.39
3.00 BSC
1.20
0.23
0.26
0.30
0.48
*Controlling Parameter
Notes:
1. Package may have one or more exposed tie bars at ends.
2. Pin 1 visual index feature may vary, but must be located within the hatched area.
3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
4. Exposed pad dimensions vary with paddle size.
5. JEDEC equivalent: Pending
Drawing No. C04-062
MAX
1.00
0.05
2.45
1.75
0.37
0.55
2002 Microchip Technology Inc.
DS21743A-page 17
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