TDA1308T/N2,112 查看數據表（PDF） - NXP Semiconductors.
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TDA1308T/N2,112 Datasheet PDF : 19 Pages
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NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
TDA1308AUK
D
bump A1
index area
BA
A2
E
A
e1
1/2 e1
b
∅v M C A B
∅w M C
E
1/4 e2
D
1/2 e2
C
e2
B
A
1
2
3
0
0.25
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e1 e2
v
w
mm
0.49
0.10
0.07
0.39 0.123 0.65
0.37 0.091 0.57
0.88
0.80
0.396 0.588
0.15
0.05
0.5 mm
y
0.08
OUTLINE
VERSION
IEC
TDA1308AUK
REFERENCES
JEDEC
JEITA
Fig 15. Package outline TDA1308AUK (WLCSP8)
TDA1308_A_4
Product data sheet
Rev. 04 — 25 January 2007
A1
detail X
C
y
X
EUROPEAN
PROJECTION
ISSUE DATE
06-11-20
06-12-15
© NXP B.V. 2007. All rights reserved.
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