TDA7491HV 查看數據表（PDF） - STMicroelectronics

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TDA7491HV

20 W + 20 W dual BTL class-D audio amplifier

STMicroelectronics 

Application information

TDA7491HV

7.9

Heatsink requirements

A thermal resistance of 24° C/W can be obtained using the PCB copper ground layer with

16 vias connecting it to the contact area for the slug. Ensure that the copper ground area is

a nominal 9 cm2 for 24° C/W.

Figure 31 shows the derating curves for copper areas of 4 cm2 and 9 cm2.

As with most amplifiers, the power dissipated within the device depends primarily on the

supply voltage, the load impedance and the output modulation level.

The maximum estimated power dissipation for the TDA7491HV is less than 4 W. When

properly mounted on the above PCB the junction temperature could increase by 96° C.

However, with a musical program the dissipated power is about 40% less, leading to a

temperature increase of around 60° C. Even at the maximum recommended ambient

temperature for consumer applications of 50° C there is still a clear safety margin before the

maximum junction temperature (150° C) is reached.

Figure 31. Power derating curves for PCB usedgas heatsink

Pd (W) 8

7

6

Copper Area 3x3 cm

and via holes

5

TTDDAA7749419P1HV

PPSSSSOO36-36

4

3

2

Copper Area 2x2 cm

and via holes

1

0

0 20 40 60 80 100 120 140

Tamb ( °C)

160

24/26

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