HTSSOP32 查看數據表（PDF） - NXP Semiconductors.

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HTSSOP32

Class-D audio amplifer

NXP Semiconductors. 

NXP Semiconductors

TDA8932B

Class-D audio amplifier

10. Limiting values

Table 8. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Max

Unit

VP

supply voltage

asymmetrical supply [1] −0.3

+40

V

Vx

voltage on pin x

IN1P, IN1N, IN2P, IN2N

[2] −5

+5

V

OSCREF, OSCIO, TEST

POWERUP, ENGAGE,

DIAG

[3] VSSD(HW) − 0.3 5

V

[4] VCGND − 0.3 6

V

IORM

all other pins

repetitive peak output

current

maximum output

current limiting

[5] VSS − 0.3

[6] 4

VDD + 0.3 V

-

A

Tj

Tstg

Tamb

junction temperature

storage temperature

ambient temperature

-

150

°C

−55

+150

°C

−40

+85

°C

P

power dissipation

-

5

W

Vesd

electrostatic discharge

voltage

HBM

MM

[7] −2000

[8] −200

+2000 V

+200

V

[1] VP = VDDP1 − VSSP1 = VDDP2 − VSSP2.

[2] Measured with respect to pin INREF; Vx < VDD + 0.3 V.

[3] Measured with respect to pin VSSD(HW); Vx < VDD + 0.3 V.

[4] Measured with respect to pin CGND; Vx < VDD + 0.3 V.

[5] VSS = VSSP1 = VSSP2; VDD = VDDP1 = VDDP2.

[6] Current limiting concept.

[7] Human Body Model (HBM); Rs = 1500 Ω; C = 100 pF

For pins 2, 3, 11, 14 and 15 Vesd = ±1800 V.

[8] Machine Model (MM); Rs = 0 Ω; C = 200 pF; L = 0.75 µH.

11. Thermal characteristics

Table 9. Thermal characteristics

Symbol Parameter

Conditions

SO32 package

Rth(j-a)

thermal resistance from junction free air natural convection

to ambient

JEDEC test board

2 layer application board

Ψj-lead

thermal characterization

parameter from junction to lead

Ψj-top

thermal characterization

parameter from junction to top of

package

Min Typ Max Unit

[1] -

41

44

K/W

[2] -

44

-

K/W

-

-

30

K/W

[3] -

-

8

K/W

TDA8932B_4

Product data sheet

Rev. 04 — 18 December 2008

© NXP B.V. 2008. All rights reserved.

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