TGA2520 查看數據表（PDF） - TriQuint Semiconductor
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TGA2520 Datasheet PDF : 9 Pages
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TGA2520
Input TFN
Chip Assembly & Bonding Diagram
0.01 pF
100pF
Vd
Off chip
R=10Ω
Off chip
C=0.1µF
Output TFN
Off chip
Vg
R=10Ω
100pF
Off chip
C=0.1µF
Typical Vg ≈ -0.5 V
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas www.triquint.com Phone : (972)994-8465 Fax: (972)994-8504 info-mmw@tqs.com
8
June
2006
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