TGA2513-SM 查看數據表（PDF） - TriQuint Semiconductor

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TGA2513-SM

2-20 GHz LNA/Gain Block

TriQuint Semiconductor 

Advance Product Information

July 26, 2007

TGA2513-SM

Recommended Surface Mount Package Assembly

Proper ESD precautions must be followed while handling packages.

Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.

TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven

vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed

in the table below.

Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.

The volume of solder paste depends on PCB and component layout and should be well controlled to

ensure consistent mechanical and electrical performance.

Clean the assembly with alcohol.

Typical Solder Reflow Profiles

Reflow Profile

Ramp-up Rate

Activation Time and

Temperature

Time above Melting Point

Max Peak Temperature

Time within 5 °C of Peak

Temperature

Ramp-down Rate

SnPb

3 °C/sec

60 – 120 sec @ 140 – 160 °C

60 – 150 sec

240 °C

10 – 20 sec

4 – 6 °C/sec

Pb Free

3 °C/sec

60 – 180 sec @ 150 – 200 °C

60 – 150 sec

260 °C

10 – 20 sec

4 – 6 °C/sec

Ordering Information

Part

TGA2513-SM

Package Style

QFN 12L 4x4 Surface Mount

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

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TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

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