TLP719 查看數據表（PDF） - Toshiba
零件编号
产品描述 (功能)
生产厂家
TLP719 Datasheet PDF : 7 Pages
| |||
TOSHIBA PHOTOCOUPLER IRED + PHOTO−IC
TLP719
TLP719
Digital logic ground isolation
Line receivers
Microprocessor system interfaces
Switching power supply feedback control
Industrial invertors
4.58±0.25
654
Unit: mm
The TOSHIBA TLP719 consists of a high-output infrared emitting diode and a high-
speed detector.
This unit is a 6-lead SDIP. The TLP719 is 50% smaller than the 8-pin DIP and
meets the reinforced insulation class requirements of international safety standards.
Therefore the mounting area can be reduced in equipment requiring safety standard
certification.
The TLP719 has a Faraday shield integrated on the photodetector chip to provide
an effective common mode noise transient immunity. Therefore this product is
suitable for application in noisy environmental conditions.
123
1.27±0.2
0.4±0.1
7.62±0.25
1.25±0.25
9.7±0.3
• Open collector
• Package type
: SDIP6
TOSHIBA
11-5J1S
• Isolation voltage
: 5000 Vrms (min)
• Common mode transient immunity : ±10 kV/μs (min) @VCM = 400 Vp-p
Weight: 0.26 g (typ.)
• Switching speed
: tpHL/ tpLH = 0.8 μs (max)
@ IF = 16 mA, VCC = 5 V,
• TTL compatible
RL = 1.9 kΩ, Ta = 25 °C
PIN CONFIGURATION (Top View)
• Construction mechanical rating
7.62-mm pitch
standard type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
10.16-mm pitch
TLPXXXF type
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
1
2
3
SHIELD
6 1 : ANODE
2 : N.C.
3 : CATHODE
5 4 : EMITTER (GND)
5 : COLLECTOR (OUTPUT)
4 6 : VCC
• UL-recognized
• cUL-recognized
• VDE-approved
: UL 1577, File No.E67349
: CSA Component Acceptance Service No.5A
File No.E67349
: EN 60747-5-5 , EN 62368-1 (Note1)
Note 1: When a VDE approved type is needed,
please designate the Option(D4).
© 2019
1
Toshiba Electronic Devices & Storage Corporation
SCHEMATIC
IF
1
VF
ICC
IO
VCC
6
VO
5
3
SHIELD
GND
4
A 0.1-μF bypass capacitor must be
connected between pins 4 and 6.
Start of commercial production
2007-09
2019-06-03
Share Link: 