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TSH690 查看數據表(PDF) - STMicroelectronics

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TSH690
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TSH690 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
Figure 8 : PCB component side (not to scale)
TSH690
Figure 9 : PCB solder side (not to scale)
Routing Requirements
Supply voltages : as well as any RF design
boards, decoupling of supply voltages requires
carefully routing. So, the output stage features a
10µF tank capacitor to smooth current peaks and
2 decoupling capacitors of 1nF and 100pF avoid-
ing a RF feedback to the supply.
The oscillator biasing (pin 7) requires a RF choke
self inductance of 56nH in series with R1 and also
a grounded decoupling capacitor of 1nF.
Ground : The ground routing has to be done in the
manner of decreasing resistive and inductive par-
asitics effects to guarantee the best equipotential
of the electrical ground node. By using microstrip
lines, bottom and top ground planes must be con-
nected via through holes in respect with a distance
shorter than 10 times the running wavelength. In
practice, with a standard epoxy substrate
(Er~4,5), to run at about 450MHz, distance be-
tween 2 vias must not exceed ~3cm. By using a
standard 2.54mm PCB grid, design takes profit to
avoid harmonics radiation.
Improvements
In comparison with the first diagram proposal, 2nd
& 3rd harmonics levels can be reduced respec-
tively as low as -27dBc and -34dBc by replacing
L2 with a parallel tank circuit (LC) of 10nH, 13pF.
In such a condition, fundamental output level is
slightly degraded of less than 0.5dB keeping a
good 50impedance matching.
Figure 10 : Silk screen (not to scale)
13/14

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