TSL25717 查看數據表（PDF） - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
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TSL25717 Datasheet PDF : 24 Pages
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TSL2571
LIGHT-TO-DIGITAL CONVERTER
TAOS117A − FEBRUARY 2011
PACKAGE FN
TOP VIEW
MECHANICAL DATA
466 + 10
PIN 1
466
+ 10
2000 + 100
VDD 1
SCL 2
GND 3
Dual Flat No-Lead
PIN OUT
TOP VIEW
6 SDA
5 INT
4 NC
END VIEW
650 + 50
2000
+ 100
Photodiode Array Area
295
Nominal
BOTTOM VIEW
CL of Photodiode Array Area
(Note B)
CL of Solder Contacts
20 Nominal
SIDE VIEW
203 + 8
650
300
+ 50
140 Nominal
CL of Solder Contacts
PIN 1
CL of Photodiode Array Area (Note B)
750 + 150
Pb
Lead Free
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The die is centered within the package within a tolerance of ± 3 mils.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 12. Package FN — Dual Flat No-Lead Packaging Configuration
Copyright E 2011, TAOS Inc.
20
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www.taosinc.com
The LUMENOLOGY r Company
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