UJA1075TW/5V0 查看數據表（PDF） - NXP Semiconductors.

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UJA1075TW/5V0

High-speed CAN/LIN coresystem basis chip

NXP Semiconductors. 

NXP Semiconductors

UJA1075

High-speed CAN/LIN core system basis chip

3. Ordering information

Table 1. Ordering information

Type number[1]

Package

Name

UJA1075TW/5V0/WD HTSSOP32

UJA1075TW/3V3/WD

UJA1075TW/5V0

UJA1075TW/3V3

Description

plastic thermal enhanced thin shrink small outline package;

32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die

pad

Version

SOT549-1

[1] UJA1075TW/5V0xx versions contain a 5 V regulator (V1); UJA1075TW/3V3xx versions contain a 3.3 V regulator (V1); WD versions

contain a watchdog.

4. Block diagram

BAT

GND

SCK

SDI

SDO

SCSN

WAKE1

WAKE2

WDOFF

EN

DLIN

WAKE

BAT

V1

V2

UJA1075

V1

V2

V1

V2

UV

UV

EXT. PNP

CTRL

VEXCTRL

VEXCC

WBIAS

SYSTEM

CONTROLLER

OSC

TEMP

INTN

RSTN

LIMP

LIN

TXDL

RXDL

Fig 1. Block diagram

LIN

HS-CAN

BAT

V2

CANH

CANL

TXDC

RXDC

SPLIT

015aaa118

UJA1075_2

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 02 — 27 May 2010

© NXP B.V. 2010. All rights reserved.

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