UPD160061N-XXX 查看數據表（PDF） - NEC => Renesas Technology

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UPD160061N-XXX

384-OUTPUT TFT-LCD SOURCE DRIVER (COMPATIBLE WITH 64-GRAY SCALES)

NEC => Renesas Technology 

µPD160061

12. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for mounting conditions of the µPD160061.

For more details, refer to the Semiconductor Device Mount Manual

(http://www.necel.com/pkg/en/mount/index.html).

Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under

different conditions.

µ PD160061N - ×××: TCP (TAB package)

Mounting Condition

Mounting Method

Thermocompression

Soldering

ACF

(Adhesive Conductive

Film)

Condition

Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100 g (per

solder)

Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm2, time 3 to 5

seconds.

Real bonding 165 to 180°C, pressure 25 to 45 kg/cm2, time 30 to 40

seconds. (When using the anisotropy conductive film SUMIZAC1003 of

Sumitomo Bakelite, Ltd.)

Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing

company. Be sure to avoid using two or more mounting methods at a time.

Data Sheet S15843EJ3V0DS

17

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