µPD16873/A/B/C
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For soldering methods and conditions other than those recommended, consult NEC.
For details of the recommended soldering conditions, refer to information document “Semiconductor Device
Mounting Technology Manual”.
Soldering Method
Infrared reflow
VPS
Wave Soldering
Soldering Conditions
Package peak temperature: 235°C; Time: 30 secs. max. (210°C min.);
Number of times: 3 times max.; Number of day: none; Flux:
Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is
recommended.
Package peak temperature: 215°C; Time: 40 secs. max.; (200°C min.)
Number of times: 3 times max.; Number of day: none; Flux:
Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is
recommended.
Package peak temperature: 260°C; Time: 10 secs. max.;
Preheating temperature: 120°C max.; Number of times: once;
Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.)
is recommended.
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Caution Do not use two or more soldering methods in combination.
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Data Sheet S13870EJ1V0DS00