UPD16874 查看數據表（PDF） - NEC => Renesas Technology

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UPD16874

QUAD Pch HIGH-SIDE SWITCH FOR USB

NEC => Renesas Technology 

µPD16874

RECOMMENDED SOLDERING CONDITIONS

The µPD16874 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended, contact your NEC sales representative.

Surface Mount Type

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

µPD16874GS

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher),

Count: two times, Exposure limit: Not limitedNote

IR35-00-2

VPS

Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher),

Count: two times, Exposure limit: Not limitedNote

VP15-00-2

Wave soldering

Partial heating

Solder bath temperature: 260°C Max., Time: 10 sec. Max., Count: once,

Exposure limit: not limitedNote

Pin temperature: 300°C Max., Time: 3 sec. Max., Exposure limit: not limitedNote

WS60-00-1



Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Cautions Do not use different soldering methods together (except for partial heating).

REFERENCE

Quality Grades on NEC semiconductor Devices

Semiconductor Device Mounting Technology Manual

NEC Semiconductor Device Reliability/Quality Control System

Semiconductor Selection Guide

C11531E

C10535E

C10983E

X10679X

Data Sheet S13894EJ1V0DS

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