2. PIN CONFIGURATION (Pad Layout)
Chip size: 3.60 x 17.80 mm2 TYP.
Bump size (output type A): 35 x 94 µm2 TYP.
Bump size (input & dummy): 80 x 86 µm2 TYP.
Alignment mark (mark center, unit: µm)
X
Y
M1
−1615
8715
M2
−1615
−8715
M3
1435
−8715
Alignment mark reference (unit: µm)
562
1
559
558
µ PD161622
72 60 72
204
Y(+
X(+
130 µm
141
142
146
145
Data Sheet S15649EJ2V0DS
3