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UPD3719 查看數據表(PDF) - NEC => Renesas Technology

零件编号
产品描述 (功能)
生产厂家
UPD3719
NEC
NEC => Renesas Technology NEC
UPD3719 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
µPD3719
NOTES ON THE USE OF THE PACKAGE
The application of an excessive load to the package may cause the package to warp or break, or cause chips to
come off internally. Particular care should be taken when mounting the package on the circuit board.
When mounting the package, use a circuit board which will not subject the package to bending stress, or use a
socket.
For this product, the reference value for the three-point bending strengthNote is 30 kg. Avoid imposing a load,
however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body
(ceramic).
Note Three-point bending strength test
Distance between supports: 70 mm, Support R: R 2 mm, Loading rate: 0.5 mm / min.
Load
Load
70 mm
70 mm
16

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