UPD7759C 查看數據表（PDF） - NEC => Renesas Technology

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产品描述 (功能)

生产厂家

UPD7759C

ADPCM SPEECH SYNTHESIZER LSIs

NEC => Renesas Technology 

µPD7759

4. RECOMMENDED SOLDERING CONDITIONS

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The following conditions (see tables below) must be met when soldering the µPD7759. Please consult

with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY

MANUAL" (IEI-1207).

q TYPE OF SURFACE MOUNT DEVICE

µPD7759GC-3BH:52-pin plastic QFP (s14 mm)

Soldering Process

Wave Soldering

Infrared Ray Reflow

VPS

Partial Heating Method

Soldering Conditions

Solder temperature: 260 °C or below,

Flow time: 10 seconds or below,

Temperature of pre-heat: 120 °C or below (Plastic surface temperature),

Number of flow process: 1

Peak package's surface temperature: 230 °C or below,

Reflow time: 30 seconds or below (210 °C or higher),

Number of reflow process: 1

Peak package's temperature: 215 °C or below,

Reflow time: 40 seconds or below (200 °C or higher),

Number of reflow process: 1

Terminal temperature: 300 °C or below,

Time: 3 seconds or below (Per one side of the device)

Symbol

WS60-00-1

IR30-00-1

VP15-00-1

—

Caution Do not apply more than one soldering method at any one time, except for "Partial heating method".

q TYPE OF THROUGH HOLE DEVICE

µPD7759C:40-pin plastic DIP (600mil)

Soldering Process

Wave Soldering

(only lead part)

Partial Heating Method

Soldering Conditions

Solder Temperature: 260 °C or below

Flow time: 10 seconds or below

Terminal temperature: 260 °C or below

Time: 10 seconds or below

Caution Do not jet molten solder on the surface of package.

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