VN751S(2008) 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

VN751S
(Rev.:2008)

High side driver

STMicroelectronics 

Package mechanical data

8 Package mechanical data

VN751S

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a lead-free second level interconnect . The category of second level

interconnect is marked on the package and on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com

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