VSC8021FI 查看數據表（PDF） - Vitesse Semiconductor
零件编号
产品描述 (功能)
生产厂家
VSC8021FI Datasheet PDF : 17 Pages
| |||
VITESSE
SEMICONDUCTOR CORPORATION
2.5Gb/s SONET-Compatible
8-Bit MUX/DEMUX Chipset
Data Sheet
VSC8021/VSC8022
Package Information
52-Pin Leaded
Ceramic Package (LDCC)
B
D
HEAT SINK SIDE
PACKAGE IS
CAVITY DOWN
52
1
E
45°
N
O
K
L
A
I
J
C
M
NOTES:
Drawing not to scale.
Packages: Ceramic (alumina);
Heat sink: Copper-tungsten;
Leads: Alloy 42 with gold plating.
Item
mm (Min/Max)
A
18.54/19. 56
B
1.02/1.52
C(1)
15.49/16.51
D(1)
15.24 TYP
E
1.27 TYP
F
0.76/1.02
G
16.94 TYP
H
1.91/2.41
NOTE: (1) At package body.
in (Min/Max)
0.730/0.770
0.040/0.060
0.610/0.650
0.600 TYP
0.050 TYP
0.030/0.040
0.667 TYP
0.075/0.095
Item
I
J
K(1)
L
M
N
O
—
mm (Min/Max)
0.41/0.61
2.03/2.79
0.09/0.24
4.57/5.34
27.69/30.22
0.36/0.56
1.75/1.90
—
in (Min/Max)
0.016/0.024
0.080/0.110
0.003/0.009
0.180/0.210
1.090/1.190
0.014/0.022
0.069/0.075
—
Page 16
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52028-0, Rev 4.1
05/25/01
Share Link: 