VSC8061FI 查看數據表（PDF） - Vitesse Semiconductor

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VSC8061FI

2.5Gb/s 16-Bit Multiplexer/Demultiplexer Chipset

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

Data Sheet

VSC8061/VSC8062

2.5Gb/s 16-Bit

Multiplexer/Demultiplexer Chipset

The worst-case temperature rise from case to ambient is given by the equation:

where:

∆T = P(MAX)(θSA + θCS)

θSA

=

θCS

=

ΤA(MAX) =

ΤC(MAX) =

∆T

=

P(MAX) =

Theta sink-to-ambient

Theta case-to-sink

Air temperature, user supplied (typically +55o C)

Case temperature (+85oC for Industrial range)

TC - TA

Power (2.0 W for VSC8061)

∴P

=

-∆---T--

Σθ

=

θ----TS---AC-----+-–----θT----CA----S-

θSA = ∆--P---T- – θCS

Ιf TA = 55o C and θCS (user supplied) is typically 0.6o C/W,

θSA = (---8---5----–-2----W5---5---)---°--C--- – 0.6°C ⁄ W

θSA = 14.4°C ⁄ W

Therefore, to maintain the proper case and junction temperature, a heat sink with a θSA of 14.4oC/W or less

must be selected at the appropriate air flow.

NOTE: The heat spreader is tied to VEE in both the VSC8061 and VSC8062.

G52069-0, Rev 4.3

05/11/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

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